EP3C25F324I7
Manufacturer: Intel
Brand: Intel
Model: EP3C25F324I7
Product Parameters:
Manufacturer: Intel FPGA
Product Family: Cyclone III
Device Type: FPGA (Field-Programmable Gate Array)
Logic Elements: 24,624 LEs (Logic Elements)
Maximum Operating Frequency: Capable of operating at high clock frequencies depending on the design and configuration
Package: 324-Pin FineLine BGA (Ball Grid Array)
Product Description:
The EP3C25F324I7 is an FPGA device that offers 24,624 Logic Elements (LEs), which are the basic building blocks of the programmable logic within the FPGA. These LEs can be interconnected and programmed to create custom digital circuits and implement complex logic functions.
FPGAs are known for their flexibility, as they can be reprogrammed to adapt to different functionalities even after deployment, making them suitable for a wide range of applications where hardware acceleration and real-time processing are required.
The device operates at high clock frequencies, which means it can process data and perform computations at a fast rate, contributing to high-performance applications.
The package of the EP3C25F324I7 is a 324-pin FineLine BGA (Ball Grid Array), which provides a compact form factor and efficient signal routing for integration onto printed circuit boards.
Stock:7677
Minimum Order:1
Brand: Intel
Model: EP3C25F324I7
Product Parameters:
Manufacturer: Intel FPGA
Product Family: Cyclone III
Device Type: FPGA (Field-Programmable Gate Array)
Logic Elements: 24,624 LEs (Logic Elements)
Maximum Operating Frequency: Capable of operating at high clock frequencies depending on the design and configuration
Package: 324-Pin FineLine BGA (Ball Grid Array)
Product Description:
The EP3C25F324I7 is an FPGA device that offers 24,624 Logic Elements (LEs), which are the basic building blocks of the programmable logic within the FPGA. These LEs can be interconnected and programmed to create custom digital circuits and implement complex logic functions.
FPGAs are known for their flexibility, as they can be reprogrammed to adapt to different functionalities even after deployment, making them suitable for a wide range of applications where hardware acceleration and real-time processing are required.
The device operates at high clock frequencies, which means it can process data and perform computations at a fast rate, contributing to high-performance applications.
The package of the EP3C25F324I7 is a 324-pin FineLine BGA (Ball Grid Array), which provides a compact form factor and efficient signal routing for integration onto printed circuit boards.
