EP4CE6E22I7N
Manufacturer: Intel
The Intel EP4CE6E22I7N is a member of the Cyclone IV FPGA family, designed for use in a wide range of applications such as industrial control, automotive, and communications.
Some of the key features of the EP4CE6E22I7N include:
6,016 logic elements (LEs)
270 Kbits of embedded memory
93 user I/O pins
Low power consumption
Hard IP blocks for PCI Express, DDR2/DDR3 memory interfaces, and more
1.2V core voltage and 3.3V I/O voltage
-40°C to +100°C operating temperature range
256-pin fine-pitch ball grid array (FBGA) package
The Cyclone IV FPGA family provides a low-cost and low-power solution for implementing complex digital systems in a variety of applications. The EP4CE6E22I7N offers a modest logic resource and a significant amount of embedded memory, making it suitable for applications that require both computation and storage. The hard IP blocks for various interfaces help to simplify design and reduce time-to-market. The low power consumption and wide operating temperature range make it suitable for use in a range of environments, and the FBGA package is easy to handle and solder.
Stock:5547
Minimum Order:1
The Intel EP4CE6E22I7N is a member of the Cyclone IV FPGA family, designed for use in a wide range of applications such as industrial control, automotive, and communications.
Some of the key features of the EP4CE6E22I7N include:
6,016 logic elements (LEs)
270 Kbits of embedded memory
93 user I/O pins
Low power consumption
Hard IP blocks for PCI Express, DDR2/DDR3 memory interfaces, and more
1.2V core voltage and 3.3V I/O voltage
-40°C to +100°C operating temperature range
256-pin fine-pitch ball grid array (FBGA) package
The Cyclone IV FPGA family provides a low-cost and low-power solution for implementing complex digital systems in a variety of applications. The EP4CE6E22I7N offers a modest logic resource and a significant amount of embedded memory, making it suitable for applications that require both computation and storage. The hard IP blocks for various interfaces help to simplify design and reduce time-to-market. The low power consumption and wide operating temperature range make it suitable for use in a range of environments, and the FBGA package is easy to handle and solder.
