A2F200M3F-FGG256I
Manufacturer: Microsemi
RAM capacity: 64kb
Primary attribute: ProASIC ® 3 FPGA, 200K gate, 4608 D-type trigger
Supplier device package: BGA
Packaging: pallet
Peripherals: DMA, POR, WDT
Package/housing: 256-LBGA
Operating temperature: - 40 ° C~100 ° C (TJ)
Minimum order quantity: 1
Architecture: MCU, FPGA
Core processor: ARM ® Cortex ®- M3
Series: SmartFusion ®
Connectivity: EBI/EMI, Ethernet, I ² C,SPI,UART/USART
Speed: 80MHz
Flash memory size: 256KB
Stock:7395
Minimum Order:1
RAM capacity: 64kb
Primary attribute: ProASIC ® 3 FPGA, 200K gate, 4608 D-type trigger
Supplier device package: BGA
Packaging: pallet
Peripherals: DMA, POR, WDT
Package/housing: 256-LBGA
Operating temperature: - 40 ° C~100 ° C (TJ)
Minimum order quantity: 1
Architecture: MCU, FPGA
Core processor: ARM ® Cortex ®- M3
Series: SmartFusion ®
Connectivity: EBI/EMI, Ethernet, I ² C,SPI,UART/USART
Speed: 80MHz
Flash memory size: 256KB