MC9S12XEP100MVL
Manufacturer: NXP
EEPROM capacity: 4K x 8
Number of I/Os: 152
RAM capacity: 64K x 8
Supplier device package: BGA
Packaging: pallet
Peripherals: LVD, POR, PWM, WDT
Package/housing: 208-BGA
Operating temperature: - 40 ° C~125 ° C (TA)
Oscillator type: external
Data converter: A/D 32x12b
Minimum order quantity: 1
Core processor: HCS12X
Core size: 16 bit
Voltage power (Vcc/Vdd): 1.72 V~5.5 V
Program memory type: flash memory
Program storage capacity: 1MB (1M x 8)
Series: HCS12X
Connectivity: CANbus, EBI/EMI, I ² C，IrDA，SCI，SPI
Speed: 50MHz
Stock:1238
Minimum Order:1
EEPROM capacity: 4K x 8
Number of I/Os: 152
RAM capacity: 64K x 8
Supplier device package: BGA
Packaging: pallet
Peripherals: LVD, POR, PWM, WDT
Package/housing: 208-BGA
Operating temperature: - 40 ° C~125 ° C (TA)
Oscillator type: external
Data converter: A/D 32x12b
Minimum order quantity: 1
Core processor: HCS12X
Core size: 16 bit
Voltage power (Vcc/Vdd): 1.72 V~5.5 V
Program memory type: flash memory
Program storage capacity: 1MB (1M x 8)
Series: HCS12X
Connectivity: CANbus, EBI/EMI, I ² C，IrDA，SCI，SPI
Speed: 50MHz
