TMS5704357BGWTEP
Manufacturer: Texas Instruments
Series: Hercules ™
Package: pallet
Product status: positive
Core processor: ARM ® Cortex-R5F ®
Core size: 32 bit dual core
Speed: 300 MHz
Connection: CANbus, EBI/EMI, Ethernet, FlexRay, I ² C， LINbus， MibSPI， SCI， SPI， UART/USART
Peripherals: DMA, POR, PWM, WDT
Number of I/Os: 145
Program memory size: 4MB (4M x 8)
Program memory type: Flash
EEPROM size: 128K x 8
Memory size: 512K x 8
Voltage power (Vcc/Vdd): 1.14V~1.32V
Data converter: A/D 41x12b
Oscillator type: internal
Operating temperature: - 55 ° C~125 ° C (TA)
Installation type: surface mounting
Package/Case: 337 iron phosphate benzoic acid
Supplier equipment package: 337-NFBGA (16x16)
Stock:3836
Minimum Order:1
Series: Hercules ™
Package: pallet
Product status: positive
Core processor: ARM ® Cortex-R5F ®
Core size: 32 bit dual core
Speed: 300 MHz
Connection: CANbus, EBI/EMI, Ethernet, FlexRay, I ² C， LINbus， MibSPI， SCI， SPI， UART/USART
Peripherals: DMA, POR, PWM, WDT
Number of I/Os: 145
Program memory size: 4MB (4M x 8)
Program memory type: Flash
EEPROM size: 128K x 8
Memory size: 512K x 8
Voltage power (Vcc/Vdd): 1.14V~1.32V
Data converter: A/D 41x12b
Oscillator type: internal
Operating temperature: - 55 ° C~125 ° C (TA)
Installation type: surface mounting
Package/Case: 337 iron phosphate benzoic acid
Supplier equipment package: 337-NFBGA (16x16)
