XC3S400-4FGG456C
Manufacturer: Xilinx Inc.
Brand: Xilinx Inc.
Model: XC3S400-4FGG456C
Product Parameters:
The XC3S400-4FGG456C is a Field-Programmable Gate Array (FPGA) with a maximum capacity of 4032 logic cells, 288 Kb of block RAM, and 8 Digital Clock Managers (DCMs). Other key parameters of this FPGA include:
Logic Voltage: 1.2V
Number of Logic Cells: 4032
Number of DCMs: 8
Block RAM: 288 Kb
Maximum Internal Clock Frequency: 200 MHz
Total On-Chip Power: 1.2W
Package: 456-pin Fine-pitch Ball Grid Array (FBGA)
Product Introduction:
The XC3S400-4FGG456C is a low-cost, low-power FPGA designed to meet the needs of a wide range of applications such as high-speed communication, video processing, and automotive electronics. With a maximum capacity of 4032 logic cells and 8 Digital Clock Managers (DCMs), this FPGA offers designers the flexibility to implement simple to moderately complex designs with high-speed connectivity.
The FPGA operates at a logic voltage of 1.2V and can run at a maximum internal clock frequency of 200 MHz. This, along with 288 Kb of block RAM, enables the device to deliver moderate-performance computing capabilities while consuming only 1.2W of total on-chip power.
The XC3S400-4FGG456C comes in a 456-pin Fine-pitch Ball Grid Array (FBGA) package, which provides a compact and robust form factor for the device. The package also includes advanced thermal management features that ensure reliable operation under varying operating conditions.
Overall, the XC3S400-4FGG456C is a cost-effective and low-power FPGA that offers designers the flexibility to implement simple to moderately complex designs with high-speed connectivity. The device's low power consumption, moderate capacity, and on-chip resources make it an ideal solution for a wide range of applications in the automotive, communication, and video processing industries.
Stock:7689
Minimum Order:1
Brand: Xilinx Inc.
Model: XC3S400-4FGG456C
Product Parameters:
The XC3S400-4FGG456C is a Field-Programmable Gate Array (FPGA) with a maximum capacity of 4032 logic cells, 288 Kb of block RAM, and 8 Digital Clock Managers (DCMs). Other key parameters of this FPGA include:
Logic Voltage: 1.2V
Number of Logic Cells: 4032
Number of DCMs: 8
Block RAM: 288 Kb
Maximum Internal Clock Frequency: 200 MHz
Total On-Chip Power: 1.2W
Package: 456-pin Fine-pitch Ball Grid Array (FBGA)
Product Introduction:
The XC3S400-4FGG456C is a low-cost, low-power FPGA designed to meet the needs of a wide range of applications such as high-speed communication, video processing, and automotive electronics. With a maximum capacity of 4032 logic cells and 8 Digital Clock Managers (DCMs), this FPGA offers designers the flexibility to implement simple to moderately complex designs with high-speed connectivity.
The FPGA operates at a logic voltage of 1.2V and can run at a maximum internal clock frequency of 200 MHz. This, along with 288 Kb of block RAM, enables the device to deliver moderate-performance computing capabilities while consuming only 1.2W of total on-chip power.
The XC3S400-4FGG456C comes in a 456-pin Fine-pitch Ball Grid Array (FBGA) package, which provides a compact and robust form factor for the device. The package also includes advanced thermal management features that ensure reliable operation under varying operating conditions.
Overall, the XC3S400-4FGG456C is a cost-effective and low-power FPGA that offers designers the flexibility to implement simple to moderately complex designs with high-speed connectivity. The device's low power consumption, moderate capacity, and on-chip resources make it an ideal solution for a wide range of applications in the automotive, communication, and video processing industries.
