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XC3S700A-4FTG256I

Manufacturer: Xilinx Inc.


Xilinx Inc.-XC3S700A-4FTG256I
22+
Tray
XC3S700A-4FTG256I
IC FPGA 161 I/O 256FTBGA

The XC3S700A-4FTG256I,from Xilinx Inc.,is embedded-fpgas-field-programmable-gate-arrayWhat we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please send a quote to us!

Brand: Xilinx

Model: XC3S700A-4FTG256I


Product Parameters:

Manufacturer: Xilinx

Product Category: FPGAs (Field-Programmable Gate Arrays)

RoHS: Yes

Series: Spartan-3A

Number of Logic Elements: 700,000

Number of I/Os: 234

Number of Logic Cells: 68,000

Number of CLBs (Configurable Logic Blocks): 4,320

Number of DSP48E1 Slices: 90

Operating Voltage: 1.14V to 1.26V

Operating Temperature Range: 0°C to +85°C

Package / Case: FBGA-256

Packaging: Tray


Product Description:

The XC3S700A-4FTG256I is a high-capacity FPGA from the Spartan-3A series by Xilinx. It features 700,000 logic elements and 68,000 logic cells, providing extensive programmable logic resources for various digital design applications.


With 234 I/Os, the XC3S700A-4FTG256I offers versatile connectivity options to interface with external devices and circuits. It has 4,320 CLBs, which are the basic building blocks of the FPGA, allowing for the implementation of complex logic functions.


The FPGA includes 90 DSP48E1 slices, which are dedicated digital signal processing units capable of performing high-speed arithmetic and signal processing operations. This makes the XC3S700A-4FTG256I suitable for applications requiring advanced digital signal processing capabilities.


Operating at a voltage range of 1.14V to 1.26V, the XC3S700A-4FTG256I provides efficient performance while maintaining low power consumption. It operates reliably within a temperature range of 0°C to +85°C.


The XC3S700A-4FTG256I is packaged in an FBGA-256 package, which offers a compact footprint and good thermal performance. It is provided in tray packaging for convenient handling during manufacturing and assembly processes.


The XC3S700A-4FTG256I FPGA is suitable for a wide range of applications that require high-capacity programmable logic, versatile I/O connectivity, and advanced digital signal processing capabilities. 


The XC3S700A-4FTG256I,from Xilinx Inc.,is embedded-fpgas-field-programmable-gate-arrayWhat we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please send a quote to us!

Brand: Xilinx

Model: XC3S700A-4FTG256I


Product Parameters:

Manufacturer: Xilinx

Product Category: FPGAs (Field-Programmable Gate Arrays)

RoHS: Yes

Series: Spartan-3A

Number of Logic Elements: 700,000

Number of I/Os: 234

Number of Logic Cells: 68,000

Number of CLBs (Configurable Logic Blocks): 4,320

Number of DSP48E1 Slices: 90

Operating Voltage: 1.14V to 1.26V

Operating Temperature Range: 0°C to +85°C

Package / Case: FBGA-256

Packaging: Tray


Product Description:

The XC3S700A-4FTG256I is a high-capacity FPGA from the Spartan-3A series by Xilinx. It features 700,000 logic elements and 68,000 logic cells, providing extensive programmable logic resources for various digital design applications.


With 234 I/Os, the XC3S700A-4FTG256I offers versatile connectivity options to interface with external devices and circuits. It has 4,320 CLBs, which are the basic building blocks of the FPGA, allowing for the implementation of complex logic functions.


The FPGA includes 90 DSP48E1 slices, which are dedicated digital signal processing units capable of performing high-speed arithmetic and signal processing operations. This makes the XC3S700A-4FTG256I suitable for applications requiring advanced digital signal processing capabilities.


Operating at a voltage range of 1.14V to 1.26V, the XC3S700A-4FTG256I provides efficient performance while maintaining low power consumption. It operates reliably within a temperature range of 0°C to +85°C.


The XC3S700A-4FTG256I is packaged in an FBGA-256 package, which offers a compact footprint and good thermal performance. It is provided in tray packaging for convenient handling during manufacturing and assembly processes.


The XC3S700A-4FTG256I FPGA is suitable for a wide range of applications that require high-capacity programmable logic, versatile I/O connectivity, and advanced digital signal processing capabilities. 


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