XC6SLX150-3FGG484I
Manufacturer: Xilinx Inc.
Brand: Xilinx
Model: XC6SLX150-3FGG484I
Product Parameters:
Manufacturer: Xilinx
Product Category: FPGAs (Field-Programmable Gate Arrays)
Family: Spartan-6
Series: Spartan-6 LX
Number of Logic Cells: 147,443
Number of Slices: 9,192
Number of Flip-Flops: 58,368
Number of Block RAMs: 360
Number of DSP48A1 Slices: 16
Number of I/O Pins: 346
Operating Voltage: 1.2V
Operating Temperature Range: 0°C to +85°C
Package / Case: 484-FBGA (Fine-Pitch Ball Grid Array)
Packaging: Tray
Product Description:
The XC6SLX150-3FGG484I is a member of the Spartan-6 LX family of FPGAs from Xilinx. It offers a high-performance, low-power, and cost-effective solution for various applications.
With 147,443 logic cells, 9,192 slices, and 58,368 flip-flops, the XC6SLX150-3FGG484I provides a substantial amount of resources for implementing complex digital designs. It also includes 360 block RAMs and 16 DSP48A1 slices, which are useful for memory storage and digital signal processing tasks.
The FPGA features 346 I/O pins, allowing for flexible connectivity options with external devices and peripherals. It operates at an operating voltage of 1.2V, contributing to its low-power consumption.
The XC6SLX150-3FGG484I is packaged in a 484-FBGA (Fine-Pitch Ball Grid Array) package, which provides a reliable and high-density interconnection between the FPGA and the printed circuit board.
Stock:8573
Minimum Order:1
Brand: Xilinx
Model: XC6SLX150-3FGG484I
Product Parameters:
Manufacturer: Xilinx
Product Category: FPGAs (Field-Programmable Gate Arrays)
Family: Spartan-6
Series: Spartan-6 LX
Number of Logic Cells: 147,443
Number of Slices: 9,192
Number of Flip-Flops: 58,368
Number of Block RAMs: 360
Number of DSP48A1 Slices: 16
Number of I/O Pins: 346
Operating Voltage: 1.2V
Operating Temperature Range: 0°C to +85°C
Package / Case: 484-FBGA (Fine-Pitch Ball Grid Array)
Packaging: Tray
Product Description:
The XC6SLX150-3FGG484I is a member of the Spartan-6 LX family of FPGAs from Xilinx. It offers a high-performance, low-power, and cost-effective solution for various applications.
With 147,443 logic cells, 9,192 slices, and 58,368 flip-flops, the XC6SLX150-3FGG484I provides a substantial amount of resources for implementing complex digital designs. It also includes 360 block RAMs and 16 DSP48A1 slices, which are useful for memory storage and digital signal processing tasks.
The FPGA features 346 I/O pins, allowing for flexible connectivity options with external devices and peripherals. It operates at an operating voltage of 1.2V, contributing to its low-power consumption.
The XC6SLX150-3FGG484I is packaged in a 484-FBGA (Fine-Pitch Ball Grid Array) package, which provides a reliable and high-density interconnection between the FPGA and the printed circuit board.
