XC7K325T-2FFG900I
Manufacturer: Xilinx Inc.
Product: XC7K325T-2FFG900I by Xilinx Inc.
Product Parameters:
The XC7K325T-2FFG900I is a high-end Field-Programmable Gate Array (FPGA) with a maximum capacity of 325,520 logic cells, 22.8 Mb of block RAM, and 740 DSP slices. Other key parameters of this FPGA include:
Logic Voltage: 1.0V
Number of Logic Cells: 325,520
Number of DSP Slices: 740
Block RAM: 22.8 Mb
Maximum Internal Clock Frequency: 800 MHz
Total On-Chip Power: 24W
Package: 900-pin Fine-pitch Ball Grid Array (FBGA)
Product Introduction:
The XC7K325T-2FFG900I is a high-performance FPGA designed to meet the needs of a wide range of applications such as high-speed communication, video processing, and high-performance computing. With a maximum capacity of 325,520 logic cells, this FPGA offers designers the flexibility to implement complex designs with high-speed connectivity.
The FPGA operates at a logic voltage of 1.0V and can run at a maximum internal clock frequency of 800 MHz. This, along with 22.8 Mb of block RAM and 740 DSP slices, enables the device to deliver high-performance computing capabilities.
The XC7K325T-2FFG900I comes in a 900-pin Fine-pitch Ball Grid Array (FBGA) package, which provides a compact and robust form factor for the device. The package also includes advanced thermal management features that ensure reliable operation under varying operating conditions.
Overall, the XC7K325T-2FFG900I is a versatile and high-performance FPGA that offers designers the flexibility to implement complex designs with high-speed connectivity. The device's high capacity, clock frequency, and on-chip resources make it an ideal solution for applications requiring high-performance computing and signal processing capabilities.
Stock:6650
Minimum Order:1
Product: XC7K325T-2FFG900I by Xilinx Inc.
Product Parameters:
The XC7K325T-2FFG900I is a high-end Field-Programmable Gate Array (FPGA) with a maximum capacity of 325,520 logic cells, 22.8 Mb of block RAM, and 740 DSP slices. Other key parameters of this FPGA include:
Logic Voltage: 1.0V
Number of Logic Cells: 325,520
Number of DSP Slices: 740
Block RAM: 22.8 Mb
Maximum Internal Clock Frequency: 800 MHz
Total On-Chip Power: 24W
Package: 900-pin Fine-pitch Ball Grid Array (FBGA)
Product Introduction:
The XC7K325T-2FFG900I is a high-performance FPGA designed to meet the needs of a wide range of applications such as high-speed communication, video processing, and high-performance computing. With a maximum capacity of 325,520 logic cells, this FPGA offers designers the flexibility to implement complex designs with high-speed connectivity.
The FPGA operates at a logic voltage of 1.0V and can run at a maximum internal clock frequency of 800 MHz. This, along with 22.8 Mb of block RAM and 740 DSP slices, enables the device to deliver high-performance computing capabilities.
The XC7K325T-2FFG900I comes in a 900-pin Fine-pitch Ball Grid Array (FBGA) package, which provides a compact and robust form factor for the device. The package also includes advanced thermal management features that ensure reliable operation under varying operating conditions.
Overall, the XC7K325T-2FFG900I is a versatile and high-performance FPGA that offers designers the flexibility to implement complex designs with high-speed connectivity. The device's high capacity, clock frequency, and on-chip resources make it an ideal solution for applications requiring high-performance computing and signal processing capabilities.
