XC7Z045-2FBG676I
Manufacturer: Xilinx Inc.
Product: XC7Z045-2FBG676I by Xilinx Inc.
Product Parameters:
The XC7Z045-2FBG676I is a System on Chip (SoC) with dual-core ARM Cortex-A9 processors and an FPGA fabric. The device includes 87,360 logic cells, 220 DSP slices, and 1 GB of DDR3 memory. Other key parameters of this SoC include:
Processor Cores: 2
Processor Frequency: 667 MHz
Logic Voltage: 0.95V - 1.05V
Number of Logic Cells: 87,360
Number of DSP Slices: 220
Block RAM: 4.9 Mb
DDR3 Memory: 1 GB
Maximum Internal Clock Frequency: 1 GHz
Total On-Chip Power: 7.3W
Package: 676-pin Fine-pitch Ball Grid Array (FBGA)
Product Introduction:
The XC7Z045-2FBG676I is a high-performance SoC that combines the processing power of dual-core ARM Cortex-A9 processors with the programmable logic of an FPGA. With 87,360 logic cells, 220 DSP slices, and 1 GB of DDR3 memory, this SoC offers designers the flexibility to implement complex designs with high-speed connectivity.
The SoC operates at a logic voltage of 0.95V - 1.05V and can run at a maximum internal clock frequency of 1 GHz. This, along with 4.9 Mb of block RAM and 220 DSP slices, enables the device to deliver high-performance computing capabilities.
The XC7Z045-2FBG676I comes in a 676-pin Fine-pitch Ball Grid Array (FBGA) package, which provides a compact and robust form factor for the device. The package also includes advanced thermal management features that ensure reliable operation under varying operating conditions.
Overall, the XC7Z045-2FBG676I is a versatile and high-performance SoC that offers designers the flexibility to implement complex designs with high-speed connectivity. The device's dual-core ARM Cortex-A9 processors and on-chip resources make it an ideal solution for applications requiring high-performance computing and signal processing capabilities.
Stock:5528
Minimum Order:1
Product: XC7Z045-2FBG676I by Xilinx Inc.
Product Parameters:
The XC7Z045-2FBG676I is a System on Chip (SoC) with dual-core ARM Cortex-A9 processors and an FPGA fabric. The device includes 87,360 logic cells, 220 DSP slices, and 1 GB of DDR3 memory. Other key parameters of this SoC include:
Processor Cores: 2
Processor Frequency: 667 MHz
Logic Voltage: 0.95V - 1.05V
Number of Logic Cells: 87,360
Number of DSP Slices: 220
Block RAM: 4.9 Mb
DDR3 Memory: 1 GB
Maximum Internal Clock Frequency: 1 GHz
Total On-Chip Power: 7.3W
Package: 676-pin Fine-pitch Ball Grid Array (FBGA)
Product Introduction:
The XC7Z045-2FBG676I is a high-performance SoC that combines the processing power of dual-core ARM Cortex-A9 processors with the programmable logic of an FPGA. With 87,360 logic cells, 220 DSP slices, and 1 GB of DDR3 memory, this SoC offers designers the flexibility to implement complex designs with high-speed connectivity.
The SoC operates at a logic voltage of 0.95V - 1.05V and can run at a maximum internal clock frequency of 1 GHz. This, along with 4.9 Mb of block RAM and 220 DSP slices, enables the device to deliver high-performance computing capabilities.
The XC7Z045-2FBG676I comes in a 676-pin Fine-pitch Ball Grid Array (FBGA) package, which provides a compact and robust form factor for the device. The package also includes advanced thermal management features that ensure reliable operation under varying operating conditions.
Overall, the XC7Z045-2FBG676I is a versatile and high-performance SoC that offers designers the flexibility to implement complex designs with high-speed connectivity. The device's dual-core ARM Cortex-A9 processors and on-chip resources make it an ideal solution for applications requiring high-performance computing and signal processing capabilities.
