XC7Z035-2FBG676E
Manufacturer: Xilinx
RAM capacity: 256KB
Main attribute: Kintex ™- 7 FPGA, 275K logic unit
Supplier device package: BGA
Packaging: pallet
Peripheral: DMA
Package/enclosure: 676-BBGA, FCBGA
Operating temperature: 0 ° C~100 ° C (TJ)
Minimum order quantity: 1
Architecture: MCU, FPGA
Core processor: dual ARM ® Cortex ®- A9 MPCore ™, With CoreSight ™
Series: Zynq ®- seven thousand
Connectivity: CANbus, EBI/EMI, Ethernet, I ² C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
Speed: 800MHz
Stock:1879
Minimum Order:1
RAM capacity: 256KB
Main attribute: Kintex ™- 7 FPGA, 275K logic unit
Supplier device package: BGA
Packaging: pallet
Peripheral: DMA
Package/enclosure: 676-BBGA, FCBGA
Operating temperature: 0 ° C~100 ° C (TJ)
Minimum order quantity: 1
Architecture: MCU, FPGA
Core processor: dual ARM ® Cortex ®- A9 MPCore ™, With CoreSight ™
Series: Zynq ®- seven thousand
Connectivity: CANbus, EBI/EMI, Ethernet, I ² C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
Speed: 800MHz