XCZU4CG-2FBVB900E
Manufacturer: Xilinx
Category: Integrated Circuit (IC)
Embedded: System on Chip (SoC)
Manufacturer: AMD Xilinx
Series: Zynq ® UltraScale+ ™ MPSoC CG
Packaging: pallet
Product Status: On sale
Architecture: MCU, FPGA core processor with CoreSight ™ Dual core ARM for ® Cortex ®- A53 MPCore ™， With CoreSight ™ Dual core ARM for ® Cortex ™- R5
Flash size:-
RAM size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I ² C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
Speed: 533MHz, 1.3GHz
Main attribute: Zynq ® UltraScale+ ™ FPGA, 192K+logic unit
Operating temperature: 0 ° C~100 ° C (TJ)
Package/outer: shell 900-BBGA, FCBGA
Supplier device package: BGA
Number of I/Os: 204
Basic product No.: XCZU4
Stock:2563
Minimum Order:1
Category: Integrated Circuit (IC)
Embedded: System on Chip (SoC)
Manufacturer: AMD Xilinx
Series: Zynq ® UltraScale+ ™ MPSoC CG
Packaging: pallet
Product Status: On sale
Architecture: MCU, FPGA core processor with CoreSight ™ Dual core ARM for ® Cortex ®- A53 MPCore ™， With CoreSight ™ Dual core ARM for ® Cortex ™- R5
Flash size:-
RAM size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I ² C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
Speed: 533MHz, 1.3GHz
Main attribute: Zynq ® UltraScale+ ™ FPGA, 192K+logic unit
Operating temperature: 0 ° C~100 ° C (TJ)
Package/outer: shell 900-BBGA, FCBGA
Supplier device package: BGA
Number of I/Os: 204
Basic product No.: XCZU4
