XCZU7EV-1FBVB900I
Manufacturer: Xilinx
Category: Integrated Circuit (IC)
Embedded: System on Chip (SoC)
Manufacturer: AMD Xilinsi
Series: Zynq ® UltraScale+ ™ MPSoC EV
Package: pallet
Product status: positive
Building: single chip microcomputer, FPGA
Core processor: Quad ARM Cortex-A53 MPCore ™ with CoreSight， Dual ARM Cortex-R5 ®™ with CoreSight ™™， ARM ®® Mali-400 ™ MP2
Flash size:-
Memory size: 256KB
Peripherals: DMA, WDT
Connection: CANbus, EBI/EMI, Ethernet, I ² C， MMC/SD/SDIO， SPI， UART/USART， USB OTG
Speed: 500 MHz, 600 MHz, 1.2 MHz
Main attribute: Zynq ® UltraScale+ FPGA， 504K+ ™ Logical unit
Operating temperature: - 40 ° C~100 ° C (trillion joules)
Packaging/Case: 900-BBGA, FCBGA
Supplier equipment package: 900-FCBGA (31x31)
Number of I/Os: 204
Stock:3262
Minimum Order:1
Category: Integrated Circuit (IC)
Embedded: System on Chip (SoC)
Manufacturer: AMD Xilinsi
Series: Zynq ® UltraScale+ ™ MPSoC EV
Package: pallet
Product status: positive
Building: single chip microcomputer, FPGA
Core processor: Quad ARM Cortex-A53 MPCore ™ with CoreSight， Dual ARM Cortex-R5 ®™ with CoreSight ™™， ARM ®® Mali-400 ™ MP2
Flash size:-
Memory size: 256KB
Peripherals: DMA, WDT
Connection: CANbus, EBI/EMI, Ethernet, I ² C， MMC/SD/SDIO， SPI， UART/USART， USB OTG
Speed: 500 MHz, 600 MHz, 1.2 MHz
Main attribute: Zynq ® UltraScale+ FPGA， 504K+ ™ Logical unit
Operating temperature: - 40 ° C~100 ° C (trillion joules)
Packaging/Case: 900-BBGA, FCBGA
Supplier equipment package: 900-FCBGA (31x31)
Number of I/Os: 204
