SE050A1HQ1/Z01SGZ
Manufacturer: NXP
The NXP Semiconductors SE050A1HQ1/Z01SGZ is a secure element IC designed for embedded security applications. Here are some product parameters and details:
Manufacturer: NXP Semiconductors
Part number: SE050A1HQ1/Z01SGZ
Description: Secure element IC
Operating temperature range: -40°C to 105°C
Supply voltage: 1.71V to 5.5V
Package type: HVQFN32
Memory: 256 KB of user programmable memory and 1.2 KB of one-time-programmable (OTP) memory
Security features: hardware-based security, tamper detection, secure boot, secure firmware updates, secure storage of keys and sensitive data, and support for advanced cryptographic algorithms
Interfaces: SPI, I2C, UART, USB, and ISO7816-3
Applications: authentication, encryption, secure boot, secure firmware updates, secure key storage, and other security-related functions in a wide range of embedded systems such as IoT devices, industrial control systems, and smart homes.
Note: The information provided is based on the datasheet available at the time of writing and is subject to change without prior notice.
Stock:2402
Minimum Order:1
The NXP Semiconductors SE050A1HQ1/Z01SGZ is a secure element IC designed for embedded security applications. Here are some product parameters and details:
Manufacturer: NXP Semiconductors
Part number: SE050A1HQ1/Z01SGZ
Description: Secure element IC
Operating temperature range: -40°C to 105°C
Supply voltage: 1.71V to 5.5V
Package type: HVQFN32
Memory: 256 KB of user programmable memory and 1.2 KB of one-time-programmable (OTP) memory
Security features: hardware-based security, tamper detection, secure boot, secure firmware updates, secure storage of keys and sensitive data, and support for advanced cryptographic algorithms
Interfaces: SPI, I2C, UART, USB, and ISO7816-3
Applications: authentication, encryption, secure boot, secure firmware updates, secure key storage, and other security-related functions in a wide range of embedded systems such as IoT devices, industrial control systems, and smart homes.
Note: The information provided is based on the datasheet available at the time of writing and is subject to change without prior notice.
