W29N01HVDINA
Manufacturer: Winbond
Supplier device package: BGA
Write cycle time - word, page: 25ns
Packaging: pallet
Memory interface: parallel connection
Memory format: flash memory
Memory type: non-volatile
Storage capacity: 1Gb (128M x 8)
Installation type: surface mounting
Package/enclosure: 48-VFBGA
Operating temperature: - 40 ° C~85 ° C (TA)
Technology: FLASH - NAND (SLC)
Clock frequency:-
Minimum order quantity: 260
Voltage power supply: 2.7 V~3.6 V
Series:-
Access time: 25ns
Stock:7652
Minimum Order:1
Supplier device package: BGA
Write cycle time - word, page: 25ns
Packaging: pallet
Memory interface: parallel connection
Memory format: flash memory
Memory type: non-volatile
Storage capacity: 1Gb (128M x 8)
Installation type: surface mounting
Package/enclosure: 48-VFBGA
Operating temperature: - 40 ° C~85 ° C (TA)
Technology: FLASH - NAND (SLC)
Clock frequency:-
Minimum order quantity: 260
Voltage power supply: 2.7 V~3.6 V
Series:-
Access time: 25ns