XC3S2000-4FGG676C
Manufacturer: Xilinx
The XC3S2000-4FGG676C,from Xilinx,is EmbeddedWhat we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please send a quote to us!
Number of I/Os: 489
Supplier device package: BGA
Installation type: surface mounting
Package/outer: shell 676-BGA
Operating temperature: 0 ° C~85 ° C (TJ)
Total RAM bits: 737280
Minimum order quantity: 40
Number of grids: 2000000
Voltage power supply: 1.14 V~1.26 V
Series: Spartan ®- three
Number of logic elements/units: 46080
Part status: on sale
Stock:2854
Minimum Order:1
The XC3S2000-4FGG676C,from Xilinx,is EmbeddedWhat we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please send a quote to us!
Number of I/Os: 489
Supplier device package: BGA
Installation type: surface mounting
Package/outer: shell 676-BGA
Operating temperature: 0 ° C~85 ° C (TJ)
Total RAM bits: 737280
Minimum order quantity: 40
Number of grids: 2000000
Voltage power supply: 1.14 V~1.26 V
Series: Spartan ®- three
Number of logic elements/units: 46080
Part status: on sale
