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XC6SLX9-3FTG256C

Manufacturer: Xilinx


XILINX-XC6SLX9-3FTG256C
22+
BGA256
XC6SLX9-3FTG256C

The XC6SLX9-3FTG256C,from Xilinx,is Integrated Circuits(ICs)What we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please send a quote to us!

Model: XC6SLX9-3FTG256C

Brand: XILINX


Product parameters:

- Assembly method: surface mount

- Series: Spartan-6

- Digital IO: 93

- Number of Logical Units: 6,120

- Internal memory: 72Kbit

- FPGA - Number of modules: 282

- Working temperature: -40°C ~ 100°C (TJ)

- Package: 256-TFBGA

- Standard package: 780


Product Details:

XC6SLX9-3FTG256C is an FPGA device in the XILINX Spartan-6 series, which is installed by surface mount method. The device has 93 digital IOs and 6,120 logic units, 282 in terms of the number of FPGA modules, and an internal memory capacity of 72Kbit. The operating temperature range of the XC6SLX9-3FTG256C is -40°C ~ 100°C, and the package is 256-TFBGA. The standard package for this FPGA device is 780.


XC6SLX9-3FTG256C has excellent signal processing capability and programmability, suitable for a wide range of applications, such as communications, computer vision, industrial automation and consumer electronics. XC6SLX9-3FTG256C has lower power consumption and cost, and is an economical and practical FPGA device.


The XC6SLX9-3FTG256C,from Xilinx,is Integrated Circuits(ICs)What we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please send a quote to us!

Model: XC6SLX9-3FTG256C

Brand: XILINX


Product parameters:

- Assembly method: surface mount

- Series: Spartan-6

- Digital IO: 93

- Number of Logical Units: 6,120

- Internal memory: 72Kbit

- FPGA - Number of modules: 282

- Working temperature: -40°C ~ 100°C (TJ)

- Package: 256-TFBGA

- Standard package: 780


Product Details:

XC6SLX9-3FTG256C is an FPGA device in the XILINX Spartan-6 series, which is installed by surface mount method. The device has 93 digital IOs and 6,120 logic units, 282 in terms of the number of FPGA modules, and an internal memory capacity of 72Kbit. The operating temperature range of the XC6SLX9-3FTG256C is -40°C ~ 100°C, and the package is 256-TFBGA. The standard package for this FPGA device is 780.


XC6SLX9-3FTG256C has excellent signal processing capability and programmability, suitable for a wide range of applications, such as communications, computer vision, industrial automation and consumer electronics. XC6SLX9-3FTG256C has lower power consumption and cost, and is an economical and practical FPGA device.


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